Texwipe TX758E Micro Alpha® ESD Polyester Cleanroom Swab (Knitted Polyester Tip, Stat-Rite® Transplex Handle)

Texwipe TX758E is a micro-format, ESD-safe cleanroom swab engineered for precision cleaning and controlled solvent application/removal in tight geometries where electrostatic discharge (ESD) is a process risk. It combines an ultra-clean knitted Alpha® 100% polyester micro tip with a Stat-Rite® handle made from an inherently dissipative polymer (Transplex) to provide ESD protection without relying on carbon loading, metal fillers, or ionic antistatic additives that can become contamination sources. The head is attached by complete thermal bond construction to eliminate adhesive contamination at the swab interface. The result is a low-linting swab in practical use (no swab is truly ‘lint-free’ in every process condition) that supports controlled micro-contact cleaning on sensitive parts, connectors, slots, edge features, optics-adjacent hardware, and ESD-sensitive assemblies—with consistent geometry, lot coding for traceability, and anti-static packaging for line-side handling control.

• SKU: TX758E BAG
• Type: Dry Swab (non-sterile)
• Swab family: Alpha
• Swab material: Polyester
• ESD-safe: Yes (dissipates charges in under 2 seconds when used with a solvent or solution)
• Head material: Knitted Alpha® Polyester (laundered)
• Head width: 4.0 mm (0.157")
• Head thickness: 3.0 mm (0.118")
• Head length: 10.0 mm (0.394")
• Handle material: Transplex (Stat-Rite® inherently dissipative polymer handle)
• Handle width: 3.0 mm (0.118")
• Handle thickness: 3.0 mm (0.118")
• Handle length: 80.5 mm (3.169")
• Total swab length: 90.5 mm (3.563")
• Head bond: Thermal (no adhesive)
• Handle color: Translucent
• Design notes: Flexible Head Paddle; Compact Handle
• Packaging (bag): 500 swabs per bag (5 inner bags of 100 swabs)
• Packaging (case): 5 bags per case (2,500 swabs/case)
• Packaging controls: Packaged in an anti-static bag; lot coded for traceability and quality control
• Use environments: Commonly used in ESD-sensitive controlled environments (final suitability depends on your process and qualification method)

Texwipe (an ITW company) differentiates itself in cleanroom swabbing by treating the swab as a controlled, engineered tool—not a commodity accessory. In the ESD Swab Series, the design intent is to provide static control without introducing common contamination mechanisms (carbon bloom, metal fillers, or ionic antistats), while maintaining dimensional consistency, thermal-bond construction to eliminate adhesive contamination, and packaging intended to preserve clean handling at the point of use.

SOSCleanroom (SOS) supports that manufacturing discipline with a close working relationship with Texwipe focused on continuity of supply, documentation discipline, and practical application support—so customers can standardize ESD-safe micro-cleaning steps with predictable performance and procurement reliability.

• Clean ESD protection using a Stat-Rite® (Transplex) inherently dissipative polymer handle
• No blooming carbon particles, metals, or ionic antistatic contaminants (cleaner ESD strategy for controlled environments)
• Dissipates charges in under two seconds when used with a solvent or solution
• Knitted Alpha® 100% polyester head manufactured from laundered polyester for cleanliness and durability
• Complete thermal bond construction eliminates adhesive contamination risk at the head/handle interface
• Manufactured to exacting and consistent tolerances using high-precision automated processes
• Lot coded for traceability and quality control
• Packaged in an anti-static bag; inner-bag format supports controlled issuance (open what you need, keep the remainder protected)

• Micro-access with controlled contact: Micro knit tip and flexible-head paddle improve reach and contact uniformity in tight features (connectors, slots, edge interfaces, micro pockets)
• Cleaner ESD performance pathway: Provides static dissipation without carbon-loaded or ionic-antistat contamination mechanisms that can transfer residue or particulates
• Adhesive-free swabbing interface: Thermal bond construction removes a common residue/extractables failure mode under solvent exposure and pressure
• Qualification-friendly cleanliness inputs: Typical contamination characteristics support method development and lot-to-lot monitoring where ionic or NVR background matters
• Typical ionic extractables (µg/swab): Sodium 0.71; Phosphate 0.17; Sulfate 0.15; Nitrate 0.04; Chloride 0.01; Potassium 0.02 (typicals; method-dependent)
• Typical NVR (mg/swab): 0.01 (DI water extractant) and 0.03 (IPA extractant), useful for managing dry-down film risk when wetting control is inconsistent
• Handling and investigation control: Anti-static packaging plus lot coding support controlled storage, kitting, and root-cause workflows

• Use where ESD may be a concern (ESD-sensitive assemblies and controlled workstations)
• Microelectronics, semiconductor, display assembly, electronics assembly, and test & assembly workflows
• Hard disk drive assembly and ESD-sensitive device cleaning tasks
• Optics and optics-adjacent hardware cleaning where micro access and pressure control matter
• Precision cleaning in recessed, grooved, slotted, or intersecting features (connectors, pockets, edge interfaces)
• Controlled solvent application/removal for small-area cleanup (verify compatibility to your chemistry and SOP)

• Grounded workstation discipline: Use within your established ESD control program (grounding, mats, wrist straps, verified equipment) to reduce ESD risk during micro-contact cleaning.
• Control wetness: In many micro-cleaning steps, damp is the control point. Over-wetting pools solvent into corners and spreads dissolved residues; under-wetting increases drag and can raise ESD risk.
• One-direction strokes: Use straight-line passes with overlapping coverage to lift and remove contamination; avoid circular scrubbing that can redeposit or smear.
• Single-pass face management: Treat each contact face as single-use. Rotate the micro tip as soon as it loads, then change out early to prevent transfer.
• No re-dipping into shared solvent: Re-dipping is a direct cross-contamination pathway. Use controlled dispense or single-use aliquots when practical.
• Edge awareness: Reduce pressure at burrs and sharp transitions to prevent snagging and avoid turning the swab into a particle source.

• ESD-safe vs. standard micro polyester: Choose TX758E when ESD is a documented process risk; if ESD is not a concern, a standard micro polyester swab may be sufficient for purely contamination-driven cleaning.
• Polyester knit vs. foam in micro cleaning: Knitted polyester tends to be durable and effective for capturing fine particulate and lightly bound films when properly dampened; foam may be preferred when pore-based solvent delivery or bulk absorption is the driver.
• Thermal bond is a contamination-control decision: If your process is solvent-heavy or pressure-intensive in corners, thermal bonding reduces a common “glue-line” residue risk compared to adhesive-assembled swabs.
• Packaging control matters: Inner bags of 100 support point-of-use issuance—open what you need, reseal promptly, and keep the remainder protected to reduce airborne pickup.