TX753E Mini CleanFoam® ESD-Safe Cleanroom Swab (Anti-Static Foam Swab)

Texwipe TX753E is a mini, precision CleanFoam® ESD-safe cleanroom swab built for ESD-sensitive detail cleaning where static control and contamination control must be managed together. It pairs a cleanroom-processed 100 ppi polyurethane foam head with a Stat-Rite® inherently dissipative polymer handle to provide clean ESD protection without relying on carbon loading, metals, or ionic anti-static additives that can create residue risk. The foam head is thermally bonded (no adhesive at the bond line) to reduce variability and help maintain low-linting outcomes (no swab is truly ‘lint-free’ in every process condition). TX753E is widely used for controlled solvent/solution application and removal, precision wipe-downs, and targeted residue cleanup in electronics, microelectronics, semiconductor, optics, and critical test-and-assembly workflows.

• Product type: Dry cleanroom swab (ESD-safe / anti-static foam swab)
• Swab family: CleanFoam®
• Head material: CleanFoam® cleanroom-processed 100 ppi polyurethane foam
• Handle material: Stat-Rite® inherently dissipative polymer (Transplex®), translucent
• Head bond: Thermal bond (no adhesive at the head-to-handle interface)
• Head size (typical): 3.7 mm (0.146") W x 3.4 mm (0.134") T x 10.0 mm (0.394") L
• Handle size (typical): 3.0 mm (0.118") W x 3.0 mm (0.118") T x 80.0 mm (3.150") L
• Total swab length (typical): 90.0 mm (3.543")
• Packaging (bag): 500 swabs per bag (5 inner bags of 100 swabs)
• Packaging (case): 5 bags per case (2,500 swabs per case total)
• Packaging note: Packaged in an anti-static bag; lot coded for traceability and quality control
• ESD-safe: Yes (inherently dissipative handle; designed to avoid blooming carbon particles, metals, or ionic anti-static contaminants)
• Use environments: Commonly used across ISO-class cleanrooms and ESD-controlled workstations (final suitability depends on your process, solvent/solution system, and SOP)
• Country of origin: Made in the Philippines
• Shelf life: 5 years from date of manufacture (typical guidance)

Values below are typical (not acceptance limits). Use them to compare swab families, inform risk-based selection, and support internal qualification planning. Confirm fit in your validated process (your solvent, exposure time, recovery method, and analytical requirements).

Typical ion extractables (µg/swab)

Typical non-volatile residue (NVR) (mg/swab)

Texwipe (an ITW company) engineers cleanroom swabs for contamination control, repeatable geometry, and process stability in critical environments. In the ESD swab series, Texwipe pairs cleanroom-processed foam heads with an inherently dissipative handle intended to provide ESD protection without introducing common contamination mechanisms (carbon bloom, metallic fillers, or ionic anti-static additives). Thermal bonding at the head-to-handle interface is used to reduce adhesive-driven residue risk and support more consistent lot-to-lot performance.

SOSCleanroom (SOS) supports ESD and contamination-control programs with a close working relationship with ITW Texwipe focused on continuity of supply, documentation discipline, and practical application support—so teams can standardize TX753E swabs with predictable performance and procurement reliability.

• Clean ESD protection: Stat-Rite® inherently dissipative handle engineered for ESD-safe cleaning workflows
• Anti-static contamination strategy: Designed with no blooming carbon particles, metals, or ionic anti-static contaminants
• Thermal bond construction: Eliminates adhesive contamination at the head bond line
• CleanFoam® head: Cleanroom-processed 100 ppi polyurethane foam for controlled solvent/solution delivery and pickup
• Precision mini format: Rigid head core and compact handle for stable detail work in tight geometries
• Lot coded + anti-static packaging: Supports traceability, staging control, and ESD workstation discipline
• Charge dissipation positioning: Designed to dissipate charges in under two seconds when used with a solvent or solution (process-dependent)

• Static control where cleaning friction happens: Helps reduce charge-driven particle attraction and ESD risk during detail cleaning on sensitive devices
• Reduced residue risk at the bond line: Thermal bonding helps avoid adhesive as a contamination variable
• Precision access and control: Mini foam head supports controlled swabbing in corners, crevices, connector interiors, small recesses, and intersecting surfaces
• Qualification-friendly data: Published typical extractables and NVR data supports selection logic and internal qualification planning
• Traceability support: Lot coding and defined packaging configuration support investigations, change control, and audit readiness

• ESD-sensitive cleaning in microelectronics, semiconductor, and electronics test-and-assembly environments
• Precision wipe-downs in connectors, ports, slots, tracks, seams, and small recesses
• Applying and removing lubricants, adhesives, and process solutions where ESD may be a concern
• Detail cleaning of optics-adjacent components where controlled wetness and low-linting outcomes matter
• Targeted residue cleanup on fixtures, tooling interfaces, and assembly touchpoints

• Maintain ESD control at the station: Use within your ESD control plan (grounding, approved containers, and compliant handling) so the swab’s dissipative intent is not undermined.
• Target “damp,” not dripping: When using IPA or other approved solvents/solutions, pre-wet to a controlled damp condition to reduce pooling, streaking, and film risk as solvent flashes.
• Single-pass discipline: Use straight-line, overlapping strokes; rotate the swab head to present a clean face rather than re-wiping with a loaded surface.
• Avoid torque and prying: Swabs are for wiping and controlled pickup, not levering debris. Excess torque can damage the foam head and increase particle generation.
• Change-out triggers: Replace the swab when the foam loads, snags, becomes tacky, or begins to streak/leave residue.
• No re-dip rule: Do not re-dip a used swab into a shared solvent container—this is a common cross-contamination pathway.

• Why foam for ESD detail work: Foam provides a non-fibrous wiping surface and strong solvent/solution handling for small-area cleaning, while the dissipative handle supports static control during friction-driven swabbing steps.
• Mini geometry advantage: The compact, rigid mini head is built for stable control in tight access points where larger heads can chatter, smear, or over-wet.
• Process-specific compatibility: Polyurethane foams are commonly used with IPA and many cleanroom-compatible solutions; verify compatibility to your exact chemistry, contact time, and temperature before release to production.