TX752E Medium Compressed CleanFoam® ESD-Safe Cleanroom Swab (Stat-Rite® Dissipative Handle)

Texwipe TX752E is a low-linting, ESD-safe cleanroom swab engineered for precision cleaning where static control and contamination control must coexist. It combines a cleanroom-processed CleanFoam® 100 ppi polyurethane foam head with a Stat-Rite® inherently dissipative polymer handle to help manage electrostatic discharge (ESD) concerns without relying on carbon loading, metals, or ionic anti-static additives that can create residue risk. Thermal-bond construction eliminates adhesive contamination at the head-to-handle interface for more consistent performance in solvent-assisted detailing, spot cleaning, and precision removal of residues in sensitive assemblies.

• Product type: Dry cleanroom swab (ESD-safe swab)
• Head material: CleanFoam® 100 ppi polyurethane foam (cleanroom processed)
• Handle material: Stat-Rite® inherently dissipative polymer (translucent)
• Head bond: Thermal bond (no adhesive at the bond line)
• Head size (typical): 3.0 mm (0.118") W x 3.4 mm (0.134") T x 20.0 mm (0.787") L
• Handle size (typical): 2.5 mm (0.098") W x 2.5 mm (0.098") T x 50.0 mm (1.969") L
• Total swab length (typical): 70.0 mm (2.756")
• Packaging: 500 swabs/bag; 5 inner bags of 100 swabs
• Case quantity: 5 bags/case
• Packaging note: Packaged in an anti-static bag; lot coded for traceability
• Use environments: Commonly used across ISO-class cleanrooms and controlled ESD workstations (final suitability depends on your process, solvent system, and SOP)
• Country of origin: Made in the Philippines
• Shelf life: 5 years from date of manufacture (typical guidance)

Texwipe (an ITW company) differentiates itself in cleanroom swabs by treating the swab as an engineered contamination-control tool, not a commodity consumable. Across its CleanTips® swab portfolio, Texwipe emphasizes controlled materials selection, automated manufacturing for tight dimensional tolerances, thermal bonding to reduce adhesive-driven residue risk, and lot coding to support traceability and quality control in critical environments.

For ESD-sensitive cleaning, Texwipe’s ESD-safe swab series pairs clean heads (foam or polyester knit) with a Stat-Rite® inherently dissipative handle designed to provide ESD protection without introducing common contaminating additives. SOSCleanroom (SOS) supports these programs with a close working relationship with ITW Texwipe focused on continuity of supply, documentation discipline, and practical application support—so customers can standardize ESD-safe swabs with predictable performance while maintaining procurement reliability and audit readiness.

• ESD protection without “dirty” additives: Stat-Rite® inherently dissipative handle (designed to avoid blooming carbon particles, metals, and ionic anti-static contaminants)
• Thermal-bond construction: Eliminates adhesive contamination at the head bond line
• CleanFoam® head: Cleanroom-processed 100 ppi polyurethane foam with precision molded tip geometry
• Anti-static packaging: Packaged in an anti-static bag to support ESD workstation control
• High-precision manufacturing: Manufactured to exacting tolerances using automated processes
• Lot coded: Traceability and quality control support for controlled workflows
• Handle marking: “TEXWIPE” name embossed on the handle (authenticity/traceability cue)
• Charge dissipation behavior: Designed to dissipate charges quickly during solvent/solution use (process dependent)

• Static control + cleaning control: Supports precision cleaning where ESD risk and contamination risk must be managed together (especially during solvent-assisted swabbing)
• Reduced residue risk at the bond line: Thermal bonding helps avoid adhesive as a potential contamination source
• Precision access: Medium compressed foam tip helps reach recessed areas, joints, and intersecting surfaces without oversized swab heads
• Consistent swabbing geometry: Automated processes and published physical characteristics support qualification and repeatable operator technique
• Program readiness: Lot coding and anti-static packaging support controlled-environment documentation expectations

• Applying and removing lubricants, adhesives, and process solutions in critical clean environments with ESD concerns
• Scrubbing recessed areas, slots, and tight joints
• Removal of excess materials or debris from precision features
• Cleaning intersecting surfaces and interface lines
• Cleaning with compatible solutions and solvents (verify solvent compatibility to your process and SOP)
• Use at ESD-safe workstations in microelectronics, semiconductor, optics, and electronics test-and-assembly workflows

• ESD discipline first: Use within your ESD control plan (grounding, ionization where applicable, and approved glove/garment practices) to avoid defeating the benefit of an ESD-safe swab.
• Control wetness: Pre-wet to a controlled damp condition when required by your cleaning method—avoid over-wetting open-cell foam, which can drive liquid into seams and corners.
• Single-pass strokes: Use straight-line strokes and rotate the swab head to a clean face rather than re-wiping with a loaded surface.
• Pressure management: Let the foam do the work; excessive pressure can increase friction, increase charge generation, and increase the risk of redepositing soil.
• Change-out triggers: Replace the swab when the head loads, snags, becomes tacky, or begins to streak/leave residue.

• ESD-safe vs. standard foam swabs: Choose TX752E when static control is part of the cleaning risk profile (ESD-sensitive devices, assemblies, or yields affected by electrostatic attraction); choose standard foam swabs when ESD is not a concern and your SOP does not require an ESD-safe tool.
• Compressed medium tip: Use this geometry when you need precision access with a foam head that can absorb and control small volumes of solvent/solution while mechanically capturing particulates.
• Thermal bond preference: When residue control matters, thermal bonding is often selected to avoid adhesive as a variability driver at the bond line.