Texwipe TX757E Micro CleanFoam® ESD Swab (Anti-Static Swab, Stat-Rite® Handle, 100 PPI Polyurethane Foam)

Texwipe TX757E is a micro-size, ESD-safe CleanFoam® cleanroom swab engineered for precision cleaning and controlled solvent application/removal in static-sensitive builds where the act of cleaning can introduce ESD risk. It pairs a cleanroom-processed 100 PPI polyurethane foam swab head with a Stat-Rite® handle made from a patented inherently dissipative polymer (Transplex) to deliver clean ESD protection without relying on blooming carbon, metal fillers, or ionic anti-static additives that can become contamination sources. The head is attached by complete thermal bond construction to eliminate adhesive contamination at the bond line. In practical use, foam swabs are selected for low-linting performance (no swab is truly ‘lint-free’ in every process condition), predictable solvent handling, and controlled micro-contact cleaning on connectors, slots, edge features, recessed pockets, optics-adjacent hardware, and ESD-sensitive assemblies—with lot coding and anti-static packaging to support consistent line-side handling.

• SKU: TX757E BAG
• Type: Dry Swab (non-sterile)
• Swab family: CleanFoam
• Swab material: Foam
• ESD-safe: Yes (dissipates charges in under 2 seconds when used with a solvent or solution)
• Head material: CleanFoam® polyurethane foam, cleanroom processed, 100 PPI
• Head width: 3.8 mm (0.15")
• Head thickness: 3.4 mm (0.134")
• Head length: 10.0 mm (0.394")
• Handle material: Transplex (Stat-Rite® inherently dissipative polymer handle)
• Handle width: 3.0 mm (0.118")
• Handle thickness: 3.0 mm (0.118")
• Handle length: 80.7 mm (3.177")
• Total swab length: 90.7 mm (3.571")
• Head bond: Thermal (complete thermal bond; no adhesive)
• Handle color: Translucent
• Design notes: Flexible Head Paddle; Compact Handle
• Packaging (bag): 500 swabs per bag (5 inner bags of 100 swabs)
• Packaging (case): 5 bags of 500 swabs per case (2,500 swabs/case)
• Packaging controls: Packaged in an anti-static bag; lot coded for traceability and quality control
• Use environments: Commonly used in ESD-sensitive controlled environments (final suitability depends on your process and qualification method)

Texwipe (an ITW company) designs cleanroom swabs as controlled process tools with defined materials, consistent geometry, and packaging aligned to contamination-control realities. In the ESD Series, the engineering goal is simple and valuable: provide static dissipation using an inherently dissipative handle approach while avoiding common contamination mechanisms associated with blooming carbon, metals, or ionic anti-static additives. Thermal-bond construction removes adhesive variability, while lot coding and anti-static packaging support disciplined line-side handling.

SOSCleanroom (SOS) supports that manufacturing discipline with continuity of supply, documentation-forward order handling, and practical application support—so customers can standardize ESD-safe micro-cleaning steps without uncontrolled substitutions that change process behavior.

• Clean ESD protection with Stat-Rite® handle (patented inherently dissipative polymer approach)
• No blooming carbon particles, metals, or ionic anti-static contaminants (cleaner ESD strategy for controlled environments)
• Dissipates charges in under two seconds when used with a solvent or solution
• Cleanroom processed 100 PPI polyurethane CleanFoam® head for controlled solvent handling and particulate pickup
• Complete thermal bond construction eliminates adhesive contamination risk at the head/handle interface
• Manufactured to exacting and consistent tolerances using high-precision automated processes
• Lot coded for traceability and quality control
• Packaged in an anti-static bag; inner-bag format supports controlled issuance (open what you need, keep the remainder protected)

• Micro-access with controlled contact: Micro foam head and compact handle support short, repeatable strokes in connectors, slots, micro pockets, edge interfaces, and recessed features
• Cleaner ESD performance pathway: Static dissipation without carbon-loaded or ionic-antistat contamination mechanisms that can transfer residue or particulates
• Adhesive-free bond line: Thermal bonding removes a common residue/extractables failure mode under solvent exposure and pressure
• Residue-awareness for solvent steps: Typical NVR values are commonly reviewed during qualification and troubleshooting; TX757E typical NVR is 0.02 mg/swab (DI water extractant) and 0.05 mg/swab (IPA extractant) (typicals; method-dependent)
• Handling and investigation control: Anti-static packaging plus lot coding support controlled storage, kitting, and root-cause workflows

• Use where ESD may be a concern (ESD-controlled workstations and ESD-sensitive assemblies)
• Circuit board assembly, display assembly, electronics assembly, and electronics test & assembly workflows
• Hard disk drive and precision device assembly cleaning tasks
• Microelectronics and semiconductor cleaning in tight geometries
• Optics benches and optics-adjacent hardware where micro access and wetness control matter
• Localized solvent application/removal for small-area cleanup (verify compatibility to your chemistry and SOP)

• Grounded workstation discipline: Use within your established ESD control program (grounding, mats, wrist straps where required, verified equipment) to reduce ESD risk during micro-contact cleaning.
• Control wetness (damp is the target): Over-wetting floods microfeatures, spreads dissolved residues, and creates dry-down marks; under-wetting increases drag and can increase tribocharging risk.
• One-direction strokes: Use straight-line passes with overlapping coverage to lift and remove; avoid circular scrubbing that can redeposit or smear.
• Single-pass face management: Treat each contact face as single-use. Rotate the micro head as soon as it loads, then change out early to prevent transfer.
• No re-dipping into shared solvent: Re-dipping is a direct cross-contamination pathway. Use controlled dispense or single-use aliquots when practical.
• Compatibility check: Validate solvent and material compatibility to your SOP (foam swabs are commonly used with alcohols; validate any ketone exposure before standardizing).
• Standards awareness: Align classification and documentation posture to your program needs (ISO: https://www.iso.org/standard/53394.html; FDA: https://www.fda.gov; ASTM: https://www.astm.org; IEST: https://www.iest.org).

• ESD-safe vs. standard micro foam swabs: Choose TX757E when ESD is a documented risk during cleaning or rework. If ESD is not part of the process risk, a non-ESD micro foam swab may be sufficient.
• Foam vs. knitted polyester for micro cleaning: Foam is commonly chosen for controlled solvent handling and “soft” contact; knitted polyester may be preferred when abrasion resistance, wipe feel, or recovery behavior is the primary driver. Match the head material to the soil type and the surface geometry.
• Thermal bond is a contamination-control decision: If your process is solvent-heavy or pressure-intensive in corners, adhesive-free thermal bonding reduces a common bond-line residue risk.
• Packaging control matters: Inner bags of 100 support point-of-use issuance—open what you need, reseal promptly, and keep the remainder protected to reduce airborne pickup.