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Texwipe TX768T Micro Pick ESD Swab

Texwipe TX768T Micro Pick ESD Swab (0.1 mm Head)

$62.03
SKU: TX768T BAG Stock Item
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Type:
Dry Swab
Family:
Swab Tool
ESD-Safe:
Yes

Texwipe TX768T Micro Pick ESD Swab - 0.1 mm Precision Tip - Non-Sterile

Texwipe TX768T is an ultra-fine ESD-safe micro pick designed for precision manipulation, localized debris removal, and controlled cleaning of miniature features in static-sensitive environments. Its 0.1 mm nominal pick tip provides access to extremely narrow recesses, seams, grooves, and intersecting surfaces where conventional foam or polyester cleanroom swabs may be too large.

Manufactured from Stat-Rite® inherently dissipative polymer, TX768T provides a solid precision tool for picking, lifting, separating, and removing small particles or excess materials. The 68.0 mm overall length supports close operator control, while the engineered polymer construction helps manage electrostatic charge without conventional carbon, metallic, or ionic antistatic additives. TX768T is cleanroom processed, lot coded, and packaged in protective anti-static bags.

Micro Pick Precision Advantage: TX768T combines an extremely fine 0.1 mm nominal tip with inherently dissipative Stat-Rite® construction for controlled pick-and-lift work in ESD-sensitive environments. Unlike foam, cotton, or polyester swabs, TX768T is a solid micro-pick tool rather than an absorbent wiping product. It is intended for localized mechanical manipulation and removal of debris, not bulk liquid absorption or conventional wet wiping.

Specifications:
  • Manufacturer: ITW Texwipe
  • Part Number: TX768T
  • Product Family: ESD-Safe Micro Pick / Swab Tool
  • Product Type: Solid Precision Micro Pick
  • Swab Format: Dry, single-use precision pick tool
  • Material: Stat-Rite® inherently dissipative polymer
  • Head Construction: Solid, finely formed polymer pick tip
  • Nominal Head Width: 0.1 mm (approximately 0.004")
  • Nominal Head Thickness: 0.1 mm (approximately 0.004")
  • Head Length: 9.0 mm (0.354")
  • Handle Width: 2.6 mm (0.102")
  • Handle Thickness: 2.6 mm (0.102")
  • Handle Length: 59.0 mm (2.323")
  • Overall Tool Length: 68.0 mm (2.677")
  • Head Attachment: Manufacturer-described thermal-bond construction without adhesives
  • ESD Characteristics: Inherently dissipative polymer construction
  • Handle Additives: Designed without blooming carbon particles, metal fillers, or ionic antistatic additives
  • Absorbency: Solid micro-pick construction; not intended for liquid absorption
  • Cleaning Method: Precision pick, lift, and localized mechanical removal
  • Sterility: Non-sterile
  • Processing: Cleanroom processed
  • Packaging: Anti-static protective bag
  • Bag Quantity: 500 picks
  • Inner Packaging: 5 inner bags of 100 picks
  • Case Quantity: 60 bags of 500 picks
  • Total Case Quantity: 30,000 picks
  • Traceability: Lot coded for quality control
  • Temperature Guidance: Applications below 194°F (90°C), subject to actual process conditions
  • Available Purchase Options: Bag of 500 or case of 30,000 picks
  • Availability: Stock item, subject to current inventory
About the Manufacturer:

Texwipe, an ITW company, develops contamination-control consumables for semiconductor manufacturing, electronics assembly, pharmaceutical production, biotechnology, medical devices, precision optics, and laboratory operations. Its specialized swab and precision-tool portfolio includes polyurethane foam, polyester knit, nonwoven polyester, and ESD-safe solid pick products for critical cleaning and handling applications.

The Texwipe ESD-Safe Swab Series incorporates Stat-Rite® inherently dissipative polymer technology to help manage electrostatic charge without conventional carbon-loaded, metallic, or ionic antistatic additive systems. TX768T uses this technology in an ultra-fine solid micro-pick configuration designed for repeatable precision contact and localized mechanical material removal.

SOSCleanroom is an authorized Master Distributor of ITW Texwipe. Our team supports customers with ESD-safe product selection, manufacturer documentation, product configurations, lot traceability, and procurement assistance for contamination-sensitive manufacturing operations.

TX768T Features:
  • Ultra-fine 0.1 mm nominal precision pick tip
  • Solid Stat-Rite® inherently dissipative polymer construction
  • ESD-safe design for static-sensitive handling applications
  • 68.0 mm overall length for controlled precision work
  • 9.0 mm long micro-pick head for localized access
  • Designed for picking, lifting, and manipulating small debris and materials
  • Engineered for consistent geometry through precision automated manufacturing
  • Manufacturer-described adhesive-free thermal-bond construction
  • No conventional carbon, metallic, or ionic antistatic additives
  • Cleanroom-processed material for controlled-environment applications
  • Protective anti-static bag packaging
  • Lot coded for traceability and quality control
  • Non-sterile, single-use format
  • 500 picks per bag with 5 inner bags of 100
  • 60 bags per case, totaling 30,000 picks
TX768T Benefits:
  • Ultra-Fine Access: The 0.1 mm nominal pick geometry supports contact with extremely small features where conventional cleaning swabs may not fit.
  • Precision Debris Removal: Solid-tip construction allows operators to pick and lift localized particles or excess material without relying on an absorbent head.
  • ESD Management: Stat-Rite® technology supports electrostatic control when used within an appropriately grounded ESD workstation.
  • Controlled Contact: Small tip geometry helps limit contact with adjacent components during precise manipulation.
  • Reduced Adhesive Contamination: Manufacturer-described thermal-bond construction avoids adhesive at the head attachment.
  • Clean Material Design: Inherently dissipative polymer avoids conventional additives that can contribute particulate or ionic contamination.
  • Operator Control: Short overall length permits close positioning and low-force manipulation of miniature features.
  • Reduced Rework Potential: Controlled pick-and-lift procedures can help prevent debris from being pushed deeper into joints or transferred across adjacent surfaces.
  • Repeatable Procedures: Defined tool geometry supports standardized operator handling and localized cleaning methods.
  • Material Traceability: Lot identification supports receiving and quality-control procedures.
  • Controlled Dispensing: Inner bags of 100 picks support point-of-use issuance and reduced unnecessary package handling.
  • Bulk Procurement: Large case quantities support high-volume precision manufacturing and recurring material requirements.
Common Applications:
  • Ultra-fine particle removal from semiconductor components
  • Precision cleaning and rework of ESD-sensitive electronic assemblies
  • Picking debris from micro-scale grooves and recessed features
  • Removing localized excess adhesives and compatible process residues
  • Separating or positioning small materials during inspection and rework
  • Cleaning intersecting surfaces and miniature mechanical joints
  • Removing fine powders from confined areas
  • Controlled manipulation of small electronic components
  • Microelectronics and sensor assembly operations
  • Precision equipment maintenance and inspection
  • Removing contaminants from miniature tooling and fixture features
  • Localized work in ESD-protected cleanroom environments
  • Process-controlled pick-and-lift debris removal
Best-Practice Use:
  • Inspect Before Use: Examine the micro-pick tip for deformation, damage, contamination, or irregularities.
  • Use an ESD-Protected Workstation: Follow established electrostatic-discharge control procedures during precision manipulation.
  • Handle by the Body: Avoid touching the micro-pick tip with gloves, fingers, tools, or uncontrolled surfaces.
  • Use Minimum Contact: Position the tip to contact only the intended particle, residue, or feature.
  • Pick and Lift: Use a controlled lifting motion to remove debris rather than dragging contamination across adjacent surfaces.
  • Control Applied Force: Use minimal pressure to reduce the likelihood of tip deformation, component damage, or surface scratching.
  • Maintain Visual Control: Use appropriate magnification when working with extremely small or delicate components.
  • Avoid Excessive Bending: Do not use the tip as a lever or apply mechanical forces beyond the intended precision-pick function.
  • Prevent Recontamination: Do not place a used pick tip on a workbench or return it to clean packaging.
  • Replace Damaged Picks: Discard picks when the tip becomes bent, contaminated, worn, or unable to perform the intended task.
  • Use Compatible Chemistry: When removing material softened by a cleaning solvent, confirm compatibility with the pick polymer and the cleaned component.
  • Maintain Traceability: Record lot information where required by the facility's procedures.
  • Single-Use Handling: Dispose of used picks according to the applicable contamination-control and waste-management requirements.
Precision Pick-and-Lift Cleaning Guidance:

TX768T is designed for controlled mechanical removal of small particles and excess material rather than conventional absorbent wiping. Cleaning performance depends on tip positioning, applied force, contact direction, surface characteristics, and the amount of contamination being removed.

  • Target the Contamination: Identify the location and type of residue or particle before bringing the pick into contact.
  • Use Magnification: Appropriate inspection magnification helps operators control the 0.1 mm tip and avoid unintended surface contact.
  • Establish an Approach Angle: Select a controlled contact angle based on the feature geometry and material being removed.
  • Lift Rather Than Drag: When practical, separate and remove contamination with a short lifting movement rather than a long sliding stroke.
  • Limit Contact Pressure: Avoid unnecessary force that could damage the pick tip or precision component.
  • Control Debris Transfer: Remove detached particles from the work area according to the approved procedure.
  • Avoid Re-Deposition: Do not reuse a contaminated tip on a previously cleaned surface.
  • Verify Completion: Inspect the treated feature to confirm successful removal without surface damage or residual contamination.
  • Standardize Technique: Establish appropriate contact pressure, movement direction, replacement criteria, and inspection requirements in the facility SOP.

Precision Handling Principle: Micro-pick cleaning is a localized mechanical process. The objective is to remove or reposition the target material with minimal force and minimal unintended surface contact. For extremely small features, controlled tip movement, proper magnification, and defined replacement criteria are essential for consistent results.

ESD Grounding and Charge-Control Guidance:

The Stat-Rite® inherently dissipative polymer construction supports electrostatic charge management during precision handling. However, effective ESD protection requires an established workstation grounding system, appropriate personnel controls, and handling procedures suited to the electrostatic sensitivity of the components.

  • ESD-Protected Area: Perform precision work within a controlled ESD workstation when handling static-sensitive devices.
  • Personnel Grounding: Use approved wrist straps, footwear, flooring, or other personnel grounding controls required by the facility.
  • Grounded Work Surfaces: Verify the grounding and condition of ESD mats, workbenches, fixtures, and equipment.
  • Dissipative Material: Stat-Rite® supports charge dissipation, but tool performance depends on the complete electrical pathway and contact conditions.
  • Glove Selection: Consider whether cleanroom gloves or other handling materials interrupt the intended charge-dissipation path.
  • Insulating Components: Use appropriate ionization or other approved controls when insulating materials cannot be grounded.
  • Triboelectric Charging: Contact and movement between materials can generate electrostatic charge. Avoid unnecessary rubbing or dragging.
  • Equipment Potential: Maintain appropriate potential control for sensitive components and conductive tools.
  • ESD Qualification: Verify the resistance or charge-decay characteristics needed for the specific process under documented test conditions.
  • Applicable Standards: ANSI/ESD S20.20 and IEC 61340-5-1 provide established frameworks for ESD control programs.

ESD Control Principle: Inherently dissipative construction helps manage electrostatic charge but does not independently guarantee complete ESD protection. Tool contact, grounding, operator handling, environmental conditions, and workstation controls must be considered together. TX768T should be incorporated into the facility's established ESD protection and qualification procedures.

Solid Micro Pick vs. Absorbent Swab Selection:

TX768T differs fundamentally from conventional cleanroom swabs because its working tip is formed from solid polymer rather than absorbent foam, cotton, or polyester. The correct product should be selected based on whether the cleaning operation requires mechanical manipulation, liquid absorption, solvent delivery, or wiping contact.

  • TX768T Solid Micro Pick: Preferred when the process requires ultra-fine contact, mechanical separation, or controlled picking and lifting of debris.
  • TX768D Micro Pick: Provides a larger 0.2 mm nominal pick geometry for precision operations that do not require the finer TX768T tip.
  • TX769E ESD-Safe Stick: Offers double-ended precision micro-tips for controlled manipulation and access to small features.
  • Polyurethane Foam Swabs: Appropriate when solvent absorption, localized solution delivery, or soft wiping contact is required.
  • Nonwoven Polyester Swabs: Suitable for cleaning procedures emphasizing controlled absorbency and surface contact.
  • Knitted Polyester Swabs: May be selected for durable wiping and precision cleaning where fabric-head performance is appropriate.
  • Liquid Pickup: A solid pick does not contain a foam or textile structure designed to absorb liquid.
  • Solvent Application: Select an absorbent swab when the process requires controlled solvent loading and delivery.
  • Surface Protection: Solid pick tips concentrate force over a small contact area. Use appropriate pressure limits and confirm surface compatibility.
  • Cleaning Validation: Changing between solid pick tools and absorbent swabs can affect removal efficiency, residue redistribution, and material-contact characteristics.

Product Selection Guidance: Choose TX768T when the cleaning task requires a 0.1 mm precision pick for localized mechanical removal. If the procedure requires solvent absorption, solution transfer, or broad wiping, use an appropriately qualified foam or polyester cleanroom swab. Solid micro picks and absorbent cleaning swabs should not be treated as interchangeable tools in controlled cleaning methods.

Solvent Compatibility and Material Handling:
  • Polymer Compatibility: Confirm the Stat-Rite® material is compatible with any cleaning chemical that may contact the pick during use.
  • Isopropyl Alcohol: May be suitable in approved cleaning procedures, subject to material and surface compatibility.
  • Aggressive Solvents: Verify suitability before exposure to ketones, esters, hydrocarbons, or other chemical formulations.
  • No Bulk Absorption: TX768T is a solid tool and is not intended to retain or transfer cleaning solutions by capillary absorption.
  • Material Softening: Chemical exposure may alter polymer properties depending on concentration, temperature, and contact duration.
  • Surface Compatibility: Evaluate the mechanical and chemical sensitivity of the component being cleaned.
  • Residue Contribution: Assess extractables or surface residue contribution when used in contamination-sensitive processes.
  • Particle Generation: Excessive force, abrasion, or tip deformation may increase the risk of polymer particle generation.
  • Temperature: Follow the manufacturer's published use guidance below 90°C (194°F), along with any lower limits imposed by the process chemistry.
  • Process Qualification: Establish cleaning effectiveness and material suitability using the actual equipment, contaminant, and method.
Packaging and Storage Recommendations:
  • Bag Quantity: 500 picks
  • Inner Packaging: 5 inner bags of 100 picks each
  • Case Quantity: 60 bags
  • Total Case Quantity: 30,000 picks
  • Packaging Material: Protective anti-static bags
  • Lot Identification: Retain manufacturer lot codes according to facility requirements
  • Storage Environment: Clean, dry conditions protected from uncontrolled contamination
  • ESD Handling: Follow facility procedures for packaging and staging materials near static-sensitive devices
  • Package Integrity: Inspect bags before introducing picks into controlled areas
  • Inner-Bag Dispensing: Open only the quantity needed for the current operation
  • Tip Protection: Avoid crushing, bending, or contacting micro-pick tips during storage and handling
  • Contamination Control: Protect unused picks from particles, oils, chemical vapors, and uncontrolled contact
  • Single-Use: Discard used picks according to the applicable process procedures
Manufacturer Technical Documents:

Texwipe TX768T Manufacturer Product Information: Click Here

Texwipe ESD-Safe Swabs Product Brochure (PDF): Click Here

Texwipe Swab Technical Data Sheet Library: Click Here

SOSCleanroom TX768T Product Information: Click Here

Other Similar Products Available From SOSCleanroom.com

ESD-Safe Micro Pick and Precision Tools

Absorbent ESD-Safe Swab Alternatives

Notes: Need assistance selecting between a 0.1 mm micro pick, a larger precision pick, or an absorbent ESD-safe swab? Open the SOSCleanroom Technical Vault tab above for additional information about ESD grounding, pick-and-lift techniques, material compatibility, contamination control, and micro-tool selection. For dimension-critical applications, confirm current manufacturer tolerances before establishing acceptance criteria.

SOSCleanroom.com supports contamination-control programs with cleanroom swabs, precision picks, ESD-safe consumables, wipers, cleaning solutions, and specialized products for semiconductor, electronics, optical, laboratory, and precision manufacturing applications. Our team provides manufacturer documentation, product selection assistance, packaging information, and procurement support.

Product description updated: October 19, 2026 (SOS Technical Staff)

© 2026 SOS Supply. All rights reserved.

The Technical Vault By SOSCleanroom
ESD-Safe Precision Tool 0.1 mm Micro-Pick Solid Stat-Rite® Polymer Localized Debris Removal Micro-Feature Access Lot Traceability
Texwipe TX768T Micro Pick: why a 0.1 mm ESD-safe precision tool matters for micro-scale contamination removal

Texwipe TX768T Micro Pick ESD Swab is a non-sterile, ultra-fine precision cleaning tool designed for highly localized removal of debris and excess material from small recesses, intersecting surfaces, joints, and other difficult-to-access features in electrostatic-sensitive environments.

TX768T features a nominal 0.1 mm micro-pick tip and a compact 68 mm overall length. It is constructed from Stat-Rite® inherently dissipative polymer, providing a solid pick geometry for controlled mechanical contact and electrostatic charge management.

Unlike conventional foam, cotton, or polyester swabs, TX768T does not use an absorbent cleaning head. Its solid micro-pick construction is intended primarily for precise positioning, lifting, separating, and removing small amounts of debris or excess material from accessible micro-scale features.

Operations takeaway: TX768T is best suited to pick, lift, and remove procedures requiring extremely fine contact geometry and ESD-aware handling. Its effectiveness depends on controlled contact force, tip positioning, cleanroom handling, qualified electrostatic controls, and replacement before the tip becomes damaged or contaminated.

ISO-first context: where micro-pick tools fit in cleanroom operations control

ISO 14644-5:2025 addresses cleanroom operations through a documented Operations Control Programme (OCP) covering personnel, equipment, materials, maintenance, cleaning, and contamination control.

Micro-pick tools support these practices where conventional cleanroom swabs cannot reach small features without contacting surrounding surfaces. The tool's extremely fine geometry allows localized manipulation and removal of contamination from approved equipment and components.

In semiconductor and electronics manufacturing, these operations may also require electrostatic discharge controls. Material selection should therefore consider cleanliness, tip dimensions, mechanical contact behavior, and electrical properties together.

Control point: A micro-pick should be treated as a precision cleaning tool, not a universal substitute for absorbent swabs or cleanroom wipers. Define the acceptable contamination type, contact method, force, inspection criteria, and disposal requirements before routine use.

Specifications (SKU controls for RFQs, SOPs, and receiving)
  • Product: Texwipe ESD-Safe Micro Pick Swab
  • Manufacturer: ITW Texwipe
  • Manufacturer part number: TX768T
  • Product family: ESD-Safe Transplex® Series
  • Type: Solid micro-pick precision cleaning tool
  • Sterility: Non-sterile
  • Material: Stat-Rite® inherently dissipative polymer
  • Tip construction: Solid, non-absorbent micro-pick
  • Nominal head width: 0.1 mm (approximately 0.004")
  • Nominal head thickness: 0.1 mm (approximately 0.004")
  • Head length: 9.0 mm (0.354")
  • Handle width: 2.6 mm (0.102")
  • Handle thickness: 2.6 mm (0.102")
  • Handle length: 59.0 mm (2.323")
  • Overall length: 68.0 mm (2.677")
  • ESD properties: Inherently dissipative polymer construction
  • Manufacturing: High-precision automated processing
  • Head attachment: Manufacturer describes complete thermal-bond construction without adhesive
  • Packaging: Anti-static protective bag
  • Bag quantity: 500 tools
  • Inner packaging: 5 inner bags of 100 tools
  • Case quantity: 60 bags
  • Total case quantity: 30,000 tools
  • Traceability: Lot coded
  • Published operating-temperature guidance: Below 194°F (90°C)

Dimensional control: TX768T has a nominal 0.1 mm micro-pick width and thickness. For components requiring exact fit, verify the applicable dimensional tolerances and product specification before qualification. The nominal dimensions do not independently establish the minimum clearance needed for safe use.

Solid micro-pick construction: how TX768T differs from an absorbent swab

Although TX768T belongs to Texwipe's ESD-safe swab family, its construction and primary cleaning function differ from conventional absorbent swabs.

  • Solid polymer tip: Provides a fine contact point for controlled mechanical manipulation of small contaminants.
  • Non-absorbent construction: Does not contain a foam, cotton, or polyester liquid-absorption head.
  • Localized contact: Allows the operator to contact a targeted feature without broad contact with surrounding surfaces.
  • Pick-and-lift action: Supports careful lifting or dislodging of small debris and excess material.
  • Precise positioning: The fine tip can access features that larger cleaning tools may not reach.
  • Stat-Rite® material: Provides the tool's intended electrostatic-dissipative characteristics.
  • Controlled manufacturing: Supports repeatable nominal tool geometry.
  • Cleanroom handling: Protective packaging and careful dispensing help maintain suitability for controlled applications.

Important selection distinction: TX768T is a solid micro-pick, not a liquid-absorbing cleaning swab. If the process requires significant solvent absorption, wiping, or liquid pickup, select a qualified CleanFoam®, Absorbond®, or polyester swab with appropriate material and ESD properties.

Stat-Rite® technology and electrostatic charge management

TX768T uses Stat-Rite® inherently dissipative polymer technology. This material is designed to support electrostatic charge management in sensitive manufacturing and maintenance environments.

  • Inherently dissipative polymer: Provides electrical characteristics intended to help manage static charge.
  • Non-blooming technology: Avoids reliance on conventional migrating antistatic agents.
  • Particulate-control intent: Helps avoid contamination associated with blooming carbon particles or certain antistatic additives.
  • Localized ESD-sensitive work: Designed for use around components requiring additional electrostatic protection.
  • Stable tool construction: The micro-pick and handle are based on Stat-Rite® polymer material.
  • Program integration: Should be used alongside the facility's established grounding and ESD-control procedures.

ESD protection principle: Inherently dissipative construction helps manage charge but does not independently establish an earth-ground connection. Actual protection depends on the tool, operator, workstation, environmental conditions, and verified ESD-control system.

The ESD ground chain: tool, operator, workstation, and ground

ESD-sensitive micro-pick operations should be performed under a documented electrostatic-control procedure. The tool's dissipative construction is one element of a broader system.

  1. Identify sensitive components: Determine the required electrostatic protection for the assembly.
  2. Prepare the ESD-protected area: Use approved equipment, work surfaces, and grounding arrangements.
  3. Verify personnel grounding: Follow the designated wrist-strap, footwear, or other personnel-control procedure.
  4. Evaluate gloves: Confirm that selected gloves do not compromise the required electrical contact or grounding strategy.
  5. Verify tool handling: Use TX768T according to the approved method and contact arrangement.
  6. Control insulating materials: Manage nearby plastics, packaging, and other static-generating surfaces.
  7. Perform applicable checks: Verify resistance or grounding continuity where required by the facility ESD program.
  8. Maintain process controls: Keep ESD precautions in effect throughout handling, cleaning, inspection, and disposal.

Grounding distinction: An inherently dissipative tool is not automatically grounded simply because an operator is holding it. The actual contact path and electrical properties of gloves, personnel, tools, work surfaces, and grounding equipment must be considered when the process requires controlled charge dissipation.

Electrostatic performance and test conditions

Electrostatic behavior depends on material properties and the test conditions under which those properties are evaluated. Product qualification should use the appropriate electrical performance requirements for the intended application.

  • Material resistance: Determine whether the application requires a specific surface resistance or volume-resistivity range.
  • Charge decay: Verify the method, applied voltage, decay threshold, and test configuration if charge-decay performance is specified.
  • Contact configuration: Electrical behavior can depend on where and how the tool contacts a surface or grounding arrangement.
  • Humidity: Environmental conditions may influence electrostatic measurements and handling performance.
  • Operator grounding: Confirm the approved personnel and workstation grounding controls.
  • Insulating barriers: Consider glove materials, packaging, and any insulating surfaces.
  • Measurement documentation: Use the applicable manufacturer test data and facility acceptance criteria.

Testing interpretation: A dissipative material designation does not establish one universal charge-decay time for every use condition. For critical ESD applications, evaluate the specific resistance or charge-decay data, test configuration, environmental conditions, and applicable process requirements.

What TX768T is designed to do (typical use cases)
  • Removing localized particles from micro-scale recesses
  • Lifting small debris from accessible precision components
  • Controlled removal of excess material from fine joints
  • Cleaning intersecting surfaces using approved pick-and-lift procedures
  • Removing small amounts of compatible adhesive residue
  • Supporting precision maintenance of semiconductor manufacturing equipment
  • Localized cleaning of electrostatic-sensitive electronic assemblies
  • Detail cleaning around small connectors and equipment features
  • Controlled manipulation of fine debris during inspection or rework
  • Accessing locations unsuitable for larger foam or polyester swab heads
  • Removing accessible contamination from approved precision instrumentation
  • Supporting contamination-sensitive assembly and repair operations

Application consideration: TX768T is most useful when the process requires extremely fine contact and controlled mechanical removal. Where contamination cannot be lifted or requires broad wiping, use an appropriately qualified absorbent swab or other cleaning method.

Micro-pick geometry and controlled contact force

The nominal 0.1 mm tip is intended for extremely localized work. Small contact dimensions require careful control of tool alignment, operator force, and the material being removed.

  • Nominal tip width: 0.1 mm.
  • Nominal tip thickness: 0.1 mm.
  • Head length: 9.0 mm.
  • Small contact area: Supports precise targeting of individual features.
  • Contact pressure: Localized forces can be concentrated at the fine tip, so use the minimum practical force.
  • Tool alignment: Avoid twisting, side-loading, or levering against delicate components.
  • Feature clearance: Confirm actual dimensions and tolerances before use in critical-fit openings.
  • Tip inspection: Replace the tool if the tip bends, deforms, fractures, or loses its required geometry.

Precision handling: A smaller tip can improve access but may increase concentrated contact stress. The cleaning procedure should specify acceptable force, approach angle, removal direction, and replacement criteria to help protect sensitive surfaces.

Pick-and-lift cleaning versus conventional wiping

TX768T is better suited to localized mechanical removal than broad wiping. Using the correct motion can help prevent contamination from being pushed deeper into a feature or dragged across a sensitive surface.

  • Pick: Position the tip at the target contaminant using controlled contact.
  • Lift: Gently raise or separate the accessible material from the surface.
  • Remove: Transfer the removed debris away from the critical feature using the approved method.
  • Inspect: Verify the surface condition and confirm that the contamination has been removed.
  • Replace: Change tools when the tip becomes contaminated or its geometry is compromised.
  • Avoid dragging: Long scraping motions can smear residues or damage delicate features.
  • Avoid spreading: Work toward an accessible removal point rather than forcing contamination into a recess.

Technique distinction: A micro-pick does not provide the liquid absorption or broad contact area of a foam or polyester swab. For dissolved contamination, final solvent wiping, or significant liquid pickup, use a cleaning tool specifically designed and qualified for those functions.

Solvent compatibility and localized material removal

Certain micro-pick procedures may involve contact with compatible cleaning solutions, lubricants, or adhesives. TX768T's solid polymer construction should be evaluated against the actual chemistry and contact conditions before use.

  • Solid polymer construction: Does not provide the absorbent liquid reservoir of foam or polyester swabs.
  • Localized solution contact: May be used in qualified procedures involving small amounts of compatible liquid.
  • Polymer compatibility: Verify that the solution does not cause swelling, softening, cracking, or other deterioration.
  • Adhesive removal: Evaluate compatibility with both the adhesive and the underlying substrate.
  • Residue transfer: Avoid transferring contaminated liquid or dissolved material into adjacent features.
  • Electrical behavior: Determine whether chemical exposure affects required electrostatic properties.
  • Flammable solutions: Follow appropriate ventilation, ignition-source, and electrostatic safety procedures.
  • Tool selection: Use an absorbent ESD-safe swab when controlled liquid pickup is required.

Solvent qualification: Verify chemical compatibility with the complete Stat-Rite® polymer tool and the cleaned substrate. Solvent exposure should not be assumed acceptable for every formulation or contact duration. Where liquid absorption is needed, TX768T should not replace an appropriate absorbent cleaning swab.

Best-practice use (micro-feature cleaning and ESD control)
  1. Confirm product selection: Verify TX768T and the required nominal 0.1 mm micro-pick configuration.
  2. Inspect the packaging: Check product identification, protective packaging, and applicable lot information.
  3. Prepare the ESD work area: Establish the approved workstation and personnel grounding arrangements.
  4. Verify feature clearance: Confirm the tip can access the target area without damaging surrounding components.
  5. Dispense carefully: Remove the tool without contacting the tip against uncontrolled surfaces.
  6. Inspect the tip: Confirm that it is straight, intact, and free from visible contamination.
  7. Use compatible gloves: Select gloves that meet the cleanliness and electrostatic requirements of the operation.
  8. Position accurately: Align the tip with the target contamination.
  9. Apply minimal force: Use only the force needed to contact or lift the material.
  10. Use pick-and-lift motion: Avoid unnecessary dragging, scraping, twisting, or broad wiping.
  11. Remove contamination: Follow the approved process for collecting and disposing of the loosened material.
  12. Inspect the result: Verify that the surface meets the applicable cleaning or inspection criteria.
  13. Replace when necessary: Discard the tool when contaminated, damaged, or unsuitable for further precision work.
  14. Dispose correctly: Follow facility waste-handling and contamination-control procedures.

Method standardization tip: Define the allowed contact force, approach angle, pick direction, removal method, tip inspection criteria, and change-out frequency in the SOP. Consistent technique is essential for repeatable micro-scale cleaning.

Contamination control and tool-cleanliness considerations
  • Material composition: Solid Stat-Rite® polymer avoids an absorbent fabric or foam cleaning head.
  • Particulate contamination: Controlled handling helps prevent debris from collecting on the fine tip.
  • Mechanical debris: Aggressive scraping or contact with sharp surfaces can create tool wear or damage.
  • Extractable residues: Establish appropriate limits where the process is sensitive to polymer extractables.
  • Ionic contamination: Evaluate product suitability when specific ionic acceptance limits apply.
  • Surface transfer: Avoid reusing a contaminated tip on previously cleaned components.
  • Lot traceability: Retain lot information when required by quality procedures.
  • Critical applications: Use current technical data and applicable product qualification testing for measurable cleanliness requirements.

Material cleanliness: Inherently dissipative polymer construction supports electrostatic-control objectives, but it does not establish that the tool is completely free of particles, ions, or extractable residues. Use documented cleanliness acceptance criteria when required.

Operating temperature and material limitations
  • Published operating guidance: Use below 194°F (90°C).
  • Polymer stability: Elevated temperature may affect the tip's mechanical or electrical characteristics.
  • Hot equipment: Allow components to reach approved handling conditions before cleaning.
  • Sterilization: Do not assume the product is suitable for arbitrary autoclave or dry-heat processing.
  • Solvent exposure: Consider the combined effects of temperature and chemistry on the tool.
  • Mechanical integrity: Inspect the fine tip after exposure that may cause deformation.
  • Storage: Protect from excessive heat, chemical vapors, moisture, and physical damage.

Temperature control: The published 90°C guidance is an operating-use limit, not automatic approval for sterilization or high-temperature processing. Applications outside normal operating conditions require specific material qualification.

Packaging, lot traceability, and receiving controls
  • Manufacturer part number: TX768T.
  • Bag quantity: 500 tools.
  • Inner packaging: Five inner bags of 100 tools.
  • Case quantity: 60 bags.
  • Total case quantity: 30,000 tools.
  • Protective packaging: Anti-static bag.
  • Lot identification: Lot coded for traceability.
  • Receiving verification: Confirm product code, nominal tip geometry, ordered unit, package integrity, and quantity.
  • Opened-bag handling: Protect unused tools from contamination and tip damage.
  • Controlled dispensing: Use the inner-pack configuration to limit unnecessary handling of unused tools.
  • Storage: Maintain clean, protected conditions consistent with manufacturer guidance and facility requirements.
  • ESD handling: Follow the applicable electrostatic-control procedure after removing tools from protective packaging.

Ordering control: TX768T is packaged as 500 tools per bag, divided into five inner bags of 100. A full case contains 60 bags or 30,000 tools. Confirm the selected bag or case purchase option when ordering through SOSCleanroom.

Common micro-pick failure modes and prevention
  • Tip deformation: Reduce applied force and avoid side-loading or levering the micro-pick.
  • Surface scratching: Verify substrate compatibility, cleanliness, tip alignment, and contact force.
  • Debris pushed into a recess: Adjust the pick direction and removal method to avoid forcing material deeper into the feature.
  • Residue smearing: Replace broad dragging motions with controlled pick-and-lift procedures.
  • Tip contamination: Replace the tool before collected material can be transferred to another surface.
  • Incomplete ESD control: Confirm personnel grounding and workstation requirements.
  • Incorrect tool selection: Use an absorbent swab if the task requires significant solvent or liquid pickup.
  • Uncontrolled operator variation: Standardize the angle, force, contact duration, and replacement criteria.
Misuse controls & when not to use TX768T
  • If absorbent wiping is required: Select an appropriate CleanFoam®, polyester, or Absorbond® swab.
  • If significant solvent pickup is necessary: Do not treat the solid micro-pick as a liquid reservoir.
  • If the surface scratches easily: Validate contact force and substrate compatibility before use.
  • If the tool must enter a critical-fit opening: Verify actual dimensions and manufacturing tolerances.
  • If sterility is required: Do not substitute the non-sterile TX768T for an approved sterile device.
  • If a verified grounding path is required: Confirm the complete ESD-control arrangement.
  • If electrical isolation is required: Evaluate whether a dissipative polymer tool is appropriate for the procedure.
  • If the chemical is incompatible: Use a qualified alternative tool and cleaning chemistry.
  • If excessive force is needed: Reevaluate the cleaning method rather than increasing pressure on the fine tip.
  • If the tool is deformed or contaminated: Replace it immediately.
  • If the operating temperature exceeds published guidance: Use a suitable temperature-qualified tool.
Selection notes: TX768T versus other ESD-safe precision tools

Different ESD-safe micro-picks and swabs provide different tip geometries, materials, and cleaning functions. The selected product should match the feature clearance, contamination type, handling requirements, and electrostatic-control program.

Selection principle: Use solid micro-picks for localized mechanical contact and removal. Select absorbent ESD-safe swabs when the method requires solvent loading, liquid removal, or broader wiping contact. A change in tool material or geometry should be evaluated before substitution in a validated or defect-sensitive process.

Recommended cleanroom glove and handling pairing

Fine-tip precision work requires both contamination control and accurate tool handling. Compatible gloves help reduce direct transfer of particles and residues while supporting controlled grip and movement.

Why this matters: A precision micro-pick can be compromised by contaminated gloves, unsuitable work surfaces, improper ESD controls, or excessive handling pressure. Maintain the required cleanliness and electrostatic-control practices throughout the operation.

Glove discipline: Verify glove suitability for the cleanliness requirements and the established ESD grounding method. Do not assume ordinary cleanroom gloves provide the electrical characteristics required for every electrostatic-control process.

Why buy ITW Texwipe TX768T Micro Pick from SOSCleanroom
  • Master Distributor alignment: SOSCleanroom is an authorized Master Distributor for ITW Texwipe, supporting accurate product selection and purchasing consistency.
  • Configuration control: Purchasing by exact manufacturer part number TX768T helps prevent substitutions involving different micro-tip dimensions or material characteristics.
  • Technical resources: Product information and available documentation support evaluation of precision cleaning, material selection, and ESD-control requirements.
  • Packaging flexibility: Bag and case options help align purchasing with routine production or precision maintenance needs.
  • One-cart procurement: Coordinate ESD-safe precision tools with suitable cleanroom gloves, absorbent swabs, wipers, and related contamination-control supplies.
Manufacturer documentation (authoritative references)
  • SOSCleanroom TX768T product page: Click Here
  • Texwipe TX768T official product specifications: Click Here
  • Texwipe ESD-Safe Transplex® Swabs Product Brochure: Click Here
  • Texwipe ESD-Safe Swab Series: Click Here
  • ESD Association Standards and Electrostatic Control Resources: Click Here
  • ISO 14644-5:2025 Cleanroom Operations Standard: Click Here

Technical documentation: Manufacturer product information provides nominal TX768T geometry, Stat-Rite® material identification, packaging quantities, and general application guidance. For controlled applications requiring certified micro-tip dimensions, electrical characteristics, or specific contamination limits, obtain the applicable current technical documentation and manufacturing tolerances.

If you have any questions please email us at Sales@SOSsupply.com or give us a call at (214)340-8574. OR check out the AI ChatBot powered by SOSCleanroom data libraries - give it a try! THIS IS NEW FOR 2026! © 2026 SOSCleanroom. All rights reserved.